Method of managing a plating liquid used in a plating apparatus

Details Method of managing a plating liquid used in a plating apparatus Method of managing a plating liquid used in a plating apparatus

2007-02-06

2007-02-06

Wilkins, III, Harry D. (Department: 1742)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Involving measuring, analyzing, or testing

C205S101000

Reexamination Certificate

active

10627684

ABSTRACT:
The concentration of a leveler in a plating liquid that is used by a plating apparatus for filling metal such as copper in interconnection trenches and holes defined in the surface of a semiconductor substrate or the like is determined based on a peak area (Ar value) in a peel-off region of the plating liquid measured according to a CV or CVS process.

REFERENCES:
patent: 3674672 (1972-07-01), Whitesell
patent: 4132605 (1979-01-01), Tench et al.
patent: H36 (1986-03-01), Smith
patent: 4624857 (1986-11-01), Dahms
patent: 5192403 (1993-03-01), Chang et al.
patent: 5223118 (1993-06-01), Sonnenberg et al.
patent: 5352350 (1994-10-01), Andricacos et al.
patent: 6113769 (2000-09-01), Uzoh et al.
patent: 0 154 705 (1985-09-01), None
patent: 4-74898 (1992-03-01), None
patent: 5-106100 (1993-04-01), None
Gluzmann et al., Proc. AESF Annu. Tech. Conf. (1992), 79th(v.2), pp. 719-728.
Freitag et al., Plat. and Surf. Fin., 70(10), 1983, pp. 55-60.

Affiliated with

Also associated with

Rating

Method of managing a plating liquid used in a plating apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of managing a plating liquid used in a plating apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of managing a plating liquid used in a plating apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3872164