Semiconductor device manufacturing: process – Radiation or energy treatment modifying properties of...
Reexamination Certificate
2011-01-18
2011-01-18
Vu, David (Department: 2818)
Semiconductor device manufacturing: process
Radiation or energy treatment modifying properties of...
C257S407000, C438S104000, C438S142000, C438S149000, C438S151000, C438S157000, C438S197000, C438S199000
Reexamination Certificate
active
07871943
ABSTRACT:
Embodiments of the invention provide methods for making an integrated circuit comprising providing a substrate, forming a structured layer stack on the substrate comprising a dielectric layer located on the substrate and an oxide-free metallic layer located on the dielectric layer, wherein the metallic layer comprising a transition metal. The method further comprises oxidizing the metallic layer, thereby increasing a work function of the metallic layer. Moreover, a substrate for making an integrated circuit is described.
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Boescke Tim
Mono Tobias
Chi Suberr
Patterson & Sheridan LLP
Qimonda AG
Vu David
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