Metal treatment – Compositions – Heat treating
Patent
1983-12-19
1986-09-02
Roy, Upendra
Metal treatment
Compositions
Heat treating
29576B, 29576T, 148187, 427 531, 357 91, H01L 21265, H01L 2126
Patent
active
046094075
ABSTRACT:
Herein disclosed is a semiconductor device having at least one lower resistance region formed in the single-crystalline semiconductor film which is so formed to continuously coat both a single-crystalline semiconductor substrate and an insulating film formed on the surface of the substrate.
Since the aforementioned single-crystalline semiconductor film is used, many advantages which are not attained from the semiconductor device according to the prior art can be obtained.
The aforementioned single-crystalline semiconductor film is formed by irradiating a polycrystalline or amorphous semiconductor film with a laser beam.
REFERENCES:
patent: 4269631 (1981-05-01), Anantha et al.
patent: 4292091 (1981-09-01), Togei
patent: 4319954 (1982-03-01), White et al.
patent: 4375993 (1983-03-01), Mori et al.
patent: 4377031 (1983-03-01), Goto et al.
patent: 4377902 (1983-03-01), Shinada et al.
patent: 4381201 (1983-04-01), Sakurai
patent: 4409724 (1983-10-01), Tasch et al.
Tamura et al., Jap. Jour. Appl. Phys. 19 (1980) p. L-23.
Anantha et al., IBM-TDB, 22 (1979) 575.
Baeri et al., J. Appl. Phys. 50 (Feb. 1979), p. 788.
Gibbons et al., Appl. Phys. Letts. 34 (Jun. 1979) 831.
Bean et al., Appl. Phys. Letts. 33 (Aug. 1978) 227.
Hiroshi Tamura
Kozuka Hirotsugu
Masao Tamura
Minato Osamu
Ohba Shinya
Hitachi , Ltd.
Roy Upendra
LandOfFree
Method of making three dimensional semiconductor devices in sele does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of making three dimensional semiconductor devices in sele, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making three dimensional semiconductor devices in sele will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1095708