Method of making thin-layer component

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

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20419212, 20429806, 20429811, C23C 1434

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active

055121519

ABSTRACT:
The present invention relates to a thin-layer component having a thin layer of (100)-oriented platinum or the other metals in Group VIII, which is formed on amorphous silicon dioxide, and further relates to a thin-layer producing system for producing such thin-layer components, the thin-layer producing system being a sputtering system wherein an auxiliary electrode is provided between two electrodes.

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"Oxygen Induced Preferred Orientation of dc Sputtered Platinum", J. Vac. Scl. Technol., vol. 18, No. 2, Mar. 1981, pp. 219-222.

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