Method of making thermal printhead

Details Method of making thermal printhead Method of making thermal printhead

1994-11-21

1996-05-07

Huff, Mark F.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making named article

430 5, 347201, 347202, 29611, B41J 2335

Patent

active

055145248

ABSTRACT:
A method of making thermal printheads is provided which comprises the steps of: (a) preparing a master substrate having plural rows of unit head regions; (b) forming a head glaze member in each unit head region in each row so that an edge of the head glaze member of the unit head region aligned with that of the head glaze member of any other unit region in the same row; (c) half-cutting the master substrate along the edge of the head glaze member of the unit head region with a half-cutting dicing blade which has an inclined edge face for partially cutting the head glaze member to provide a glaze corner; and (d) forming an array of heating dots along the glaze corner; wherein at least one blade positioning mark is formed on the master substrate before the half-cutting step (c); and the half-cutting dicing blade is positionally set in the half-cutting step (c) by referring to the blade positioning mark.

REFERENCES:
patent: 4777583 (1988-10-01), Minami et al.
patent: 4861625 (1989-08-01), Kondo et al.
patent: 4973986 (1990-11-01), Narita
patent: 5109238 (1992-04-01), Watanabe et al.
patent: 5231420 (1993-07-01), Yamamoto et al.
patent: 5317341 (1994-05-01), Tatsumi
patent: 5367320 (1994-11-01), Taniguchi et al.
patent: 5373625 (1994-12-01), Shirasaki

Affiliated with

Also associated with

Rating

Method of making thermal printhead does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making thermal printhead, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making thermal printhead will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1226290