Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2008-04-01
2008-04-01
Nguyen, Thanh (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S124000, C438S127000, C257SE33066
Reexamination Certificate
active
07351611
ABSTRACT:
A mould for encapsulating an integrated circuit package on a leadframe including a top mould-half and a complementary bottom mould-half enclosing a cavity for encapsulating said package wherein structures are provided on at least one of said mould-halves which, upon the closure of said mould-halves, closes off the spaces between adjacent leads of the leadframe to allow only said leads to extend out of said cavity. The structures may be protrusions from the mould half closing off the spaces. Notches or slots cut to allow the leads' extension are the preferred structures due to ease of machining. The mould design thus enables a leadframe package to be moulded with a peripheral flange as narrow as desired without the need to cut a broad conventional flange formed up to the dam bar because only the leads and tie bars are left to be singulated. A method for making the above mould as well as singulation methods for cutting and punching the leads and tie bars is also disclosed.
REFERENCES:
patent: 5328870 (1994-07-01), Marrs
patent: 5623162 (1997-04-01), Kurihara
patent: 5897883 (1999-04-01), Cho et al.
patent: 6302673 (2001-10-01), Frechette et al.
patent: 6436736 (2002-08-01), Embong et al.
patent: 6521468 (2003-02-01), Song et al.
patent: 6627976 (2003-09-01), Chung et al.
patent: 6645794 (2003-11-01), Takahashi et al.
patent: 6696750 (2004-02-01), Yin et al.
Goh Kok Siang
Lau Kam Chuan
Suresh Dass Sasidharan
Wong Chee Heng
Yee Richard Mow Lum
Carsem (M) Sdn Bhd
Nguyen Thanh
Townsend and Townsend / and Crew LLP
LandOfFree
Method of making the mould for encapsulating a leadframe... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of making the mould for encapsulating a leadframe..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making the mould for encapsulating a leadframe... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2786132