Method of making tape carrier semiconductor device

Fishing – trapping – and vermin destroying

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437217, 257793, H01L 2160

Patent

active

053366506

ABSTRACT:
A tape carrier semiconductor device has a resin sealed area not so larger than the size of the semiconductor chip, e.g. substantially not exceeding 2 mm to the outside. A device hole is not larger than an area formed by extending the outer periphery of the semiconductor chip to the outside by 0.3 mm and an epoxy resin of 500-1200 ps in viscosity is used for sealing the chip.

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