Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate
2005-07-05
2005-07-05
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
C438S713000, C438S717000
Reexamination Certificate
active
06914009
ABSTRACT:
Transistor gate linewidths can be made to be effectively smaller by etching a notch at the bottom of the gate to reduce the effective linewidth. This can be done by etching at a layer interface, such as a silicon-germanium interface in an over-etch step.
REFERENCES:
patent: 3977925 (1976-08-01), Schwabe
patent: 5155657 (1992-10-01), Oehrlein et al.
100nm Gate Length High Performance/Low Power CMOS Transistor Structure, T. Ghani et al, IEEE 1999, 4pp, Re-print No. 0-7803-5413-3/99.
Kretz Jitske
Lill Thorsten B.
Bach Joseph
Coleman W. David
Moser, Patterson & Sheridan, NJ
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