Method of making sloped vias

Details Method of making sloped vias Method of making sloped vias

1986-10-06

1989-05-16

Lacey, David L.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156644, 156652, 156656, 1566591, 1566611, B44C 122

Patent

active

048307068

ABSTRACT:
Sloped vias are formed in a resinous layer made from a material which is curable in stages, which can be coated on a substrate prior to partial curing, which adheres to the substrate and which shrinks upon full curing by a process which includes first using a dry, directional etch to form straight walled vias in a partially cured layer of the material coated on the substrate and then fully curing the layer. The straight walled vias are changed to sloped vias during final cure when adhesive contact between the substrate and the layer of resinous material inhibits shrinking of the side of the resinous layer which contacts the substrate, while the unsupported side of the layer is free to shrink. Such sloped vias are observed to improve the integrity of conductive coatings placed in the vias by reducing cracking, peeling and flaking thereof. Sloped vias with conductive coatings are useful in the construction of computer components.

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