Method of making silicon on sapphire field effect transistors wi

Metal treatment – Process of modifying or maintaining internal physical... – Chemical-heat removing or burning of metal

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29571, 156612, 156613, 156646, 156647, 156655, 156661, 156667, 357 4, 357 23, 357 44, 357 49, 357 60, H01L 2186, H01L 2712

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041314964

ABSTRACT:
The method comprises forming a blind hole in a sapphire substrate using a sulfur hexafluoride gas etchant and an etch mask comprising a single layer of silicon nitride. The blind holes are filled with epitaxially grown silicon and field effect transistors are laid out with their gates orthogonal to a line which is at a 45.degree. angle to a standard wafer flat, i.e. orthogonal to the projection of the "c" axis onto the "r" plane of the sapphire wafer.

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Maurits, J.E.A., "Problems . . . . Preparation of SOS Wafers" Solid State Tech., Apr. 1977, pp. 81-86.
Stinson et al., "Sulfur Hexafluoride Etching Effects in Silicon" J. Electrochem. Soc., vol. 123, No. 4, Apr. 1976, pp. 551-555.
Manasevit, H.M., "Gas-Phase Etching of Sapphire IBID., vol. 121, No. 2, Feb. 1974, pp. 293-297.

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