Method of making semiconductor wafers and semiconductor wafers m

Details Method of making semiconductor wafers and semiconductor wafers m Method of making semiconductor wafers and semiconductor wafers m

1997-03-26

1998-05-05

Niebling, John

Semiconductor device manufacturing: process

With measuring or testing

438891, 438974, 438476, H01L 21322, H01L 21302

Patent

active

057473641

ABSTRACT:
A method of making semiconductor wafers can prevent processing strain on peripheral portions of wafers caused by non-wax polishing using a template. This involves mirror chamfering or etching the peripheral portions of the wafers after the non-wax polishing step.

REFERENCES:
patent: 4276114 (1981-06-01), Takano et al.
patent: 5429711 (1995-07-01), Watabe et al.
patent: 5447890 (1995-09-01), Kato et al.
patent: 5516706 (1996-05-01), Kusakabe
patent: 5679212 (1997-10-01), Kato et al.

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