Method of making semiconductor device that has improved...

Details Method of making semiconductor device that has improved... Method of making semiconductor device that has improved...

2005-10-04

2005-10-04

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

C438S033000, C438S113000

Reexamination Certificate

active

06951800

ABSTRACT:
A method of making a semiconductor device includes a back-grinding step of grinding a back surface of a semiconductor substrate, a dicing step of dicing the semiconductor substrate along predetermined dicing lines so as to make pieces of semiconductor devices after the back-grinding step, and a laser exposure step of shining laser light on the back surface of the semiconductor substrate after the back-grinding step so as to remove grinding marks generated by the back-grinding step.

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