Method of making semiconductor device

Details Method of making semiconductor device Method of making semiconductor device

2006-07-04

2006-07-04

Pham, Hoai (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S126000, C438S127000, C438S026000

Reexamination Certificate

active

07071034

ABSTRACT:
A semiconductor device includes a first lead having an inner portion on which a semiconductor chip is mounted, a second lead having an inner portion electrically connected to the semiconductor chip via a wire and a resin package for sealing the semiconductor chip and the wire. The inner portions, the semiconductor chip and the wire are coated with a coating film formed of amorphous fluororesin.

REFERENCES:
patent: 5128209 (1992-07-01), Sakai et al.
patent: 5170009 (1992-12-01), Kadokura
patent: 5482760 (1996-01-01), Takeuchi
patent: 6046075 (2000-04-01), Manteghi
patent: 6100318 (2000-08-01), Zipplies
patent: 6177726 (2001-01-01), Manteghi
patent: 6229688 (2001-05-01), Kobayashi et al.
patent: 6245259 (2001-06-01), Hohn et al.
patent: 04196601 (1992-07-01), None
patent: 96/37255 (1996-11-01), None

Affiliated with

Also associated with

Rating

Method of making semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3532435