Method of making semiconductor device

Details Method of making semiconductor device Method of making semiconductor device

1983-07-08

1984-09-18

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29580, 156653, 156657, 1566591, 156662, 156648, 357 55, 357 69, 427 88, H01L 21306, B44C 122, C03C 1500, C03C 2506

Patent

active

044722397

ABSTRACT:
A semiconductor device comprising a semiconductor body having a depression formed into the first surface of the body. The device further comprises member means comprising a thermal-to-electric or static electric element, the member means having a predetermined configuration suspended over the depression. The member means is connected to the first surface at least at one location, the depression opening to the first surface around at least a portion of the predetermined configuration. The depression provides substantial physical and thermal isolation between the element and the semiconductor body. In this manner, an integrated semiconductor device provides an environment of substantial physical and thermal isolation between the element and the semiconductor body.

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