Method of making self-aligned, lateral diffusion barrier in meta

Details Method of making self-aligned, lateral diffusion barrier in meta Method of making self-aligned, lateral diffusion barrier in meta

1994-02-28

1995-11-28

Chaudhari, Chandra

Fishing, trapping, and vermin destroying

437192, 437194, 437957, H01L 21441

Patent

active

054707889

ABSTRACT:
A method of providing interconnections to a semiconductor integrated chip designed to eliminate electromigration. The method includes the steps of forming an interconnection with segments of Al interspersed with segments of a refractory metal, wherein each aluminum segments is followed by a segment of refractory metal, aligning the aluminum and refractory metal segments with respect to each other ensuring electrical continuity.

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patent: 5101261 (1992-03-01), Maeda
R. G. Filippi, et al., "Evidence of the Electromigration Short-Length Effect in Aluminum-Based Metallurgy W/Tungsten Diffusion Barriers" Mat. Res. Soc. Symp., Proc. V. 309, pp. 141-148, 1993 Materials Research Society. (no month).

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