Method of making printed wiringboards

Details Method of making printed wiringboards Method of making printed wiringboards

1979-10-24

1981-09-15

Massie, Jerome W.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566591, 204 15, 204 23, 204 32R, H05K 306, H05K 326

Patent

active

042895758

ABSTRACT:
A predetermined portion of a wiring substrate having wiring patterns obtained by etching a copper layer formed on an insulating substrated is covered with a plating resistant first insulating film, then a portion of lead patterns is covered by a removable and plating resistance second film. Then overplated coating is applied onto predetermined wiring patterns and thereafter the second film is removed. Thereafter only lead patterns are selectively etched off.

REFERENCES:
patent: 2834723 (1958-05-01), Robinson
patent: 3475284 (1969-10-01), Olson
patent: 3483615 (1969-12-01), Gottfried
patent: 3747210 (1973-07-01), Kroll
patent: 3850711 (1974-11-01), Conley
patent: 3904492 (1975-09-01), Rich
patent: 4104111 (1978-08-01), Mack
patent: 4179800 (1979-12-01), Takaba et al.

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