Method of making printed wiring boards

Details Method of making printed wiring boards Method of making printed wiring boards

1992-05-18

1994-05-31

Nutter, Nathan M.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

427 96, 430311, 430317, 430327, 430329, 430330, G03F 726

Patent

active

053168941

ABSTRACT:
A method of making a printed wiring board comprises the steps of applying a solder resist onto a printed wiring board on which circuits for junction and pads for surface-mounting are formed, to form a solder resist layer; grinding the surface of the solder resist layer to remove the solder resist present on the circuits and the pads and to expose the surface thereof; applying a light-sensitive liquid solder resist to the surface of the printed wiring board, drying the light-sensitive solder resist layer to form a light-sensitive solder resist film; exposing the light-sensitive solder resist film to light through a mask film carrying a desired pattern; and then dissolving the un-exposed area of the light-sensitive solder resisit film with a developer to remove the same area and to cover the exposed area with the cured solder resist film. The method does not suffer any discrepancy of position of a solder resist film relative to the distributing wire and pad patterns formed on the printed wiring board and peeling off of the solder resist film and the method can ensure high reliability of soldering.

REFERENCES:
patent: 4943516 (1990-07-01), Kamayaehi et al.
patent: 5134056 (1992-07-01), Schmidt et al.

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