Method of making multilayer printed wiring board

Details Method of making multilayer printed wiring board Method of making multilayer printed wiring board

1990-09-13

1992-01-07

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156634, 156656, 1566591, 156666, 156902, 427 96, B44C 122, C23F 102

Patent

active

050788310

ABSTRACT:
A multilayer printed wiring board and a method of manufacturing the board are provided. The board has a printed wiring incorporating metal powder consisting of fine grains and a layer of insulation material which is adhesive when uncured. The fine grains of the metal powder are securely fixed to the layer of insulation material so as to strengthen the bond between the printed wiring and the layer of insulation material. Alternatively, the layer of insulation material incorporates a layer of glass powder to enhance the insulation thereof. In this case, the layer of glass powder is made by evenly spreading glass powder on a first coat of uncured adhesive insulation material. The layer of glass powder is covered by a second coat of insulation material after the first coat of insulation material is cured so that the layer of glass powder is sandwiched between the two coats of insulation material. The metal powder is evenly spread on a layer of insulation material or the second coat of insulation material while the insulation material is uncured and adhesive. After the insulation material is cured, the surface of the insulation material covered with metal powder is copper-plated and is etched to form a printed wiring incorporating the metal powder.

REFERENCES:
patent: 2739881 (1956-03-01), Kepple
patent: 2778762 (1957-01-01), Eisler
patent: 3330695 (1967-07-01), Curran
patent: 4643798 (1987-02-01), Takada et al.
patent: 4720394 (1988-01-01), Kojima et al.
patent: 4994302 (1991-02-01), Kellerman

Affiliated with

Also associated with

Rating

Method of making multilayer printed wiring board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making multilayer printed wiring board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making multilayer printed wiring board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-819594