Method of making multi-layer printed wiring boards

Details Method of making multi-layer printed wiring boards Method of making multi-layer printed wiring boards

1985-04-26

1987-05-26

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29846, 29852, 156634, 156656, 1566591, 156902, 174 685, 361414, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

046683321

ABSTRACT:
A multi-layer printed wiring board in which an internal board has a wiring pattern on both sides. Two conductive plates for establishing respective voltage planes are formed with a pattern of grooves to match the wiring pattern of the internal board. The internal board is then sandwiched to the two sides of the conductive plates, with the grooves registering with the wiring pattern, and with intermediate insulating layers. Further, insulated wiring patterns are formed on the exterior sides of the conductive plates together with through-holes through the assembly.

REFERENCES:
patent: 3351702 (1967-11-01), Stephens

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