Method of making microwave integrated circuits

Details Method of making microwave integrated circuits Method of making microwave integrated circuits

1986-09-08

1988-04-12

Schor, Kenneth M.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156654, 156663, 156901, 156902, 156651, 156633, 1566591, 29846, H05K 300

Patent

active

047372362

ABSTRACT:
A method of making a multiplicity of microwave integrated circuits is disclosed wherein a thin glass substrate is etched to contain both via holes and large area holes which receive discrete active devices therein. An electrically and thermally conductive carrier is adhered to one surface of the glass substrate with the electrical interconnections and circuit components formed on the opposing surface of the glass substrate. The method enables a multiplicity of microwave circuits to be made and tested by batch processing techniques prior to division into individual circuits.

REFERENCES:
patent: 3315133 (1967-04-01), Walker
patent: 4181249 (1980-01-01), Peterson et al.
patent: 4312117 (1982-01-01), Robillard et al.
patent: 4418470 (1983-12-01), Naster et al.
patent: 4419181 (1983-12-01), Tanaka et al.

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