Method of making micromachined refractory metal field emitters

Details Method of making micromachined refractory metal field emitters Method of making micromachined refractory metal field emitters

1986-10-14

1987-08-11

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156647, 156649, 156651, 156657, 1566591, 156662, 357 55, 427253, 437225, H01L 21306, B44C 122, B05D 512, C03C 1500

Patent

active

046859969

ABSTRACT:
A method of making a field emitter includes anisotropically etching a single crystal silicon substrate to form at least one funnel-shaped protrusion on the substrate, then conformally depositing a refractory metal onto the funnel-shaped protrusion. Alternatively, single crystal silicon may be anisotropically etched to form at least one funnel-shaped recess in the silicon. The etched surface is doped with an impurity to form an etch-stop layer, the remaining undoped silicon is removed, then the etch-stop layer is conformally deposited with a refractory metal. The funnel-shaped recess can then be back-filled with silicon or another suitable material.

REFERENCES:
patent: 3746587 (1973-07-01), Rosvold
patent: 4171234 (1979-10-01), Nagata et al.
patent: 4371803 (1983-02-01), Gigante
patent: 4396459 (1983-08-01), Herning et al.
patent: 4428111 (1984-01-01), Swartz
patent: 4614119 (1986-09-01), Zavtacky et al.
patent: 4618397 (1986-10-01), Shimizu et al.

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