Method of making micromachined device with ground plane under se

Details Method of making micromachined device with ground plane under se Method of making micromachined device with ground plane under se

1995-06-07

1996-11-26

Fourson, George

Etching a substrate: processes

Etching of semiconductor material to produce an article...

437228, 437921, H02P 616, H01G 516

Patent

active

055782248

ABSTRACT:
A polysilicon ground plane is formed over dielectric layers and under a suspended, movable mass in a surface micromachined device. The process includes steps of forming a diffused region in a substrate, forming the dielectric layers over the substrate, forming the ground plane over dielectric layers, and forming a body having a suspended mass, a first anchor extending from the mass down to the diffused region, and a second anchor extending from the mass down to the ground plane. The two anchors are formed simultaneously. The ground plane, which can be formed with only three additional steps over prior processes, serves as a ground plane to control changes and also as a local interconnect.

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"Surface Micromachined, Digitally Force-Balanced Accelerometer With Integrated CMOS Detection Circuitry," Yun, et al., IEEE Solid-State Sensor and Actuator Workshop, Hilton Head Island, SC, Jun. 22-25, 1992.
"Large Displacement Linear Actuator," Brennen, et al., IEEE Solid-State Sensor and Actuator Workshop, Hilton Head Island, SC, Jun. 4-7, 1990.

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