Method of making microelectronic package using integrated...

Details Method of making microelectronic package using integrated... Method of making microelectronic package using integrated...

2007-09-28

2011-11-29

Graybill, David (Department: 2894)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Substrate dicing

C438S068000, C438S113000, C438S114000, C438S458000, C438S460000

Reexamination Certificate

active

08067256

ABSTRACT:
A method of making a microelectronic package, and a microelectronic package made according to the method. The method includes: bonding and thermally coupling a plurality of IC dies to an IHS panel to yield a die-carrying IHS panel; mounting the die-carrying IHS panel onto a substrate panel including a plurality of package substrates to yield a combination including the die-carrying IHS panel mounted to the substrate panel; and singulating the combination to yield a plurality of microelectronic packages, each of the packages including: an IHS component of the IHS panel, one of the plurality IC dies bonded and thermally coupled to said IHS component and one of the plurality of package substrates, said IHS component and said one of the plurality of IC dies being mounted to said one of the plurality of package substrates to form said each of the packages.

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