Metal working – Method of mechanical manufacture – Electrical device making
Patent
1976-11-03
1978-01-03
Larson, Lowell A.
Metal working
Method of mechanical manufacture
Electrical device making
29590, H01R 900
Patent
active
040658511
ABSTRACT:
To improve the bonding layer for connecting wires to semiconductor chips with contact fingers, or contact strips, on a substrate carrier, the bonding layer is formed as spongy, microporous structure, applied to discrete positions of the contact strips by screen printing, and secured to the metallic connecting strip by a diffusion zone. Preferably, the bonding layer comprises a metal of gold, palladium, silver, aluminum and copper, or an alloy of at least two of these metals, or a base alloy of one of these metals, for example gold applied as a gold paste having an average grain size of less than 5 micro-meters, the layer being between 2 to 30 micrometers thick, preferably 3 to 10 micrometers. The metal is part of a paste of the metal in an evaporative organic carrier. After screen printing, the carrier is eliminated by heating; subsequent heating converts the metal to a spongy microporous structure bonded to the substrate carrier by a diffusion zone.
REFERENCES:
patent: 3537175 (1970-11-01), St. Clair et al.
patent: 3589000 (1971-06-01), Galli
patent: 3778305 (1973-12-01), Holmes et al.
Kummer Franz
Mai Gerhard
Ruthardt Rolf
Thiede Horst
Larson Lowell A.
W. C. Heraeus GmbH
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