Method of making low .kappa. dielectric inorganic/organic hybrid

Coating processes – Coating by vapor – gas – or smoke – Organic coating applied by vapor – gas – or smoke

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427515, 427578, 427 99, C23C 1600, C08J 704

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06068884&

ABSTRACT:
A method of depositing a dielectric film exhibiting a low dielectric constant in a semiconductor and/or integrated circuit by chemical vapor deposition (CVD) is provided. The film is deposited using an organosilicon precursor in a manner such that the film is comprised of a backbone made substantially of Si--O--Si or Si--N--Si groups with organic side groups attached to the backbone.

REFERENCES:
patent: 4168330 (1979-09-01), Kaganowicz
patent: 5290736 (1994-03-01), Sato et al.
patent: 5508368 (1996-04-01), Knapp et al.
patent: 5618619 (1997-04-01), Petrmichl et al.
patent: 5679413 (1997-10-01), Petrmichl et al.
Inoue et al, Plasma Sources Sci. Technol. 5(2) Abstract (pp. 339-343), 1996 No Month Data!.
Sahli et al, Mater. Chem. Phys. 33(1-2) Abstract (pp. 106-109), 1993 No Month Data!.
C. Rau et al., "Mechanisms of plasma polymerization of various silico-organic monomers", Thin Solid Films, pp. 28-37, 249 (1994) No Month Data!.
S. Sahli et al., "Properties of plasma-polysiloxane deposited by PECVD", Materials Chemistry and Physics, pp. 106-109, 33 (1993) No Month Data!.
A.R. McCabe et al., "Large Area Diamond-like Carbon Coatings by Ion Implantation", Surface Engineering vol. III: Process Technology and Surface Analysis, pp. 163-172, 1995 No Month Data!.
A.M. Wrobel et al., "Ollgomeric Products in Plasma-Polymerized Organosilicones", J. Macromol. Sci-Chem., A20(5&6), pp. 583-618 (1983) No Month Data!.
Y. Osada et al., "Plasma-Exposed Polymerization Of Cyclic Organosiloxanes In The Condensed Phase", Journal of Polymer Science: Polymer Letters Edition, vol. 19, 369-374 (1981) No Month Data!.
P. Favia et al., "The role of substrate temperature and bias in the plasma deposition from tetramethylsilane", Plasma Sources Sci. Technol. 1 (1992) pp. 59-66 No Month Data!.
D.S. Kim et al., "Deposition of thermally stable, low dielectric constant fluorocarbon/SiO.sub.2 composite thin film", American Institute of Physics, Appl. Phys. Lett., vol. 69, No. 18, Oct. 28, 1996, pp. 2776-2778.
V. Hazari et al., Characterization of Alternative Chemistries for Depositing PECVD Silicon Dioxide Films, DUMIC Conference, IMIC--333D/98/0319, pp. 319-326, Feb. 1998.
P. Favia, "Plasma Deposition of Thin Films from a Fluorine-Containing Cyclosiloxane", Journal of Polymer Science: Part A: Polymer chemistry, 1992, 0 pages No Month Data.
M. R. Wertheimer et al., "Advances In Basic and Applied Aspects Of Microwave Plasma Polymerization", Thin Solid Films, 115 (1984) pp. 109-124 No Month Data.
J.A. Theil et al., "Carbon content of silicon oxide films deposited by room temperature plasma enhanced chemical vapor deposition of hexamethyldisiloxane and oxygen", Journal of Vacuum Science Technology, A 12(4), Jul./Aug. 1994, pp. 1365-1370.
N. Inagaki et al., "Plasma Polymerization of Organosilicon Compounds", Journal of Applied Polymer Science, vol. 30, pp. 3385-3395 No Month Data.
Y. Segui et al., "In Situ Electrical Property Measurements Of Metal (Plasma Polysiloxane)/Metal Structures", Thin Solid Films, 155 (1987) pp. 175-185, Electronics and Optics No Month Data.
Y. Segui et al. "Gas Discharge In Hexamethyldisiloxane", Journal of Applied Polymer Science, vol. 20, pp. 1611-1618 (1976) No Month Data.
N. Inagaki et al., "Preparation of Siloxane-Like Films by Glow Discharge Polymerization", Journal of Applied Polymer Science, vol. 29, pp. 3595-3605 (1984) No Month Data.
V.S. Nguyen et al., "Plasma Organosilicon Polymers", J. Electrochem. Soc. Solid-State Science and Technology, vol. 132, No. 8, pp. 1925-1932, Aug. 1985.
K. J. Taylor et al., "Parylene Copolymers", Spring MRS, Symposium N, pp. 1-9, 1997 No Month Data!.

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