Method of making layered superlattice material with...

Semiconductor device manufacturing: process – Having magnetic or ferroelectric component

Reexamination Certificate

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C438S238000, C438S239000, C438S240000, C438S396000

Reexamination Certificate

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06890768

ABSTRACT:
In the manufacture of an integrated circuit memory cell, a strontium bismuth tantalate or strontium bismuth tantalum niobate thin film layer (50) is deposited on a substrate (28, 49) and a carefully controlled UV baking process is performed on the strontium bismuth tantalate layer (50) prior to the deposition of an ultra-thin bismuth tantalate layer (51). A second electrode (52) is formed on top of the ultra-thin bismuth tantalate layer (51).

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Lim, M. et al: “Sub-100 NM SrBi2Ta2O9 Film With Ultrathin BiTaO4 Film With Ultrathin BiTaO4 Capping Layer For 3 V or Lower-Voltage Ferroelectric Memory Operation”, Applied Physics Letters, Am. Institute of Physics, NY, US, vol. 81, no. 10, Sep. 2, 2002, pp. 1863-1865.
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