Method of making ingrown lead frame with strain relief

Details Method of making ingrown lead frame with strain relief Method of making ingrown lead frame with strain relief

1975-12-11

1977-05-31

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

427 88, 29591, 156633, 361400, B29C 1708

Patent

active

040267598

ABSTRACT:
A method for providing a large number of interconnections between a circuitizable wafer and a circuitizable substrate provides very fine line interconnections with built-in strain relief. A channel between the respective substrates is filled with a solvent soluble material which is applied in a manner such that a convex or concave shape is attained in the channel between the material. A sensitizer may be mixed with the solvent soluble material prior to its placement in the channel between the substrates, and then a photoresist is applied to the composite, exposed and developed, yielding the desired circuit configuration. Next, copper leads are additively electrolessly plated to the desired thickness in the exposed circuit areas. After the leads have been formed, the solvent soluble material is removed leaving curved, strain relief leads suspended in air with the two ends interconnecting the substrates.

REFERENCES:
patent: 3647585 (1972-03-01), Fritzinger et al.
patent: 3672985 (1972-06-01), Nathanson et al.
patent: 3925880 (1975-12-01), Rosvold

Affiliated with

Also associated with

Rating

Method of making ingrown lead frame with strain relief does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making ingrown lead frame with strain relief, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making ingrown lead frame with strain relief will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-655993