Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1992-10-28
1994-07-12
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156632, 156634, 156652, 156656, 1566591, 156664, 296211, C23F 100, G01L 100
Patent
active
053285514
ABSTRACT:
A method of making a foil-type electrical resistance strain gage having a gage factor of at least 4. A PtW foil is adhesively bonded to a polyimide substrate with an FEP adhesive cured under heat and pressure. The foil is spin-coated with a positive photoresist, masked, and exposed to ultraviolet light. The exposed photoresist is then developed, permitting wet etching of the foil to form a gage pattern on the substrate, which is then preferably cured.
REFERENCES:
patent: 2715666 (1955-08-01), Stinchfield
patent: 2933665 (1960-04-01), Dimeff
patent: 3922628 (1975-11-01), Hudson et al.
patent: 5049232 (1991-09-01), Tola
patent: 5193402 (1993-03-01), Reed
Dang Thi
Eaton Corporation
Johnston R. A.
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