Method of making electronic devices

Details Method of making electronic devices Method of making electronic devices

1990-02-27

1990-11-27

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156634, 156643, 156651, 156656, 156657, 1566591, H01L 21306, B44C 122, C23F 102, C03C 1500

Patent

active

049733788

ABSTRACT:
A field emission device which may be used, for example, as a surge arrester, comprises two electrode structures each comprising a substrate from which project tapered electrically-conductive emitter bodies. The structures are bonded together, face-to-face, so that the emitters all project into a sealed space formed between the substrates. The space may be evacuated or gas-filled. The emitters are formed by depositing a conductive layer on each substrate, forming masking pads on the layer at the required emitter positions, and etching the conductive layer to leave a tapered body beneath each pad. The dimensions of the emitter bodies and the spacing between the substrates are preferably of the order of a few microns.

REFERENCES:
patent: 3878423 (1975-04-01), Hill et al.
patent: 3921022 (1975-11-01), Levine
patent: 3998678 (1976-12-01), Fukase
patent: 4585991 (1986-04-01), Reid et al.
patent: 4685996 (1987-08-01), Busta et al.
patent: 4908539 (1990-03-01), Meyer

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