Method of making electrical probe diaphragms

Details Method of making electrical probe diaphragms Method of making electrical probe diaphragms

1989-09-28

1991-07-09

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156628, 156633, 156634, 156644, 156656, 156657, 1566591, 156663, B44C 122, C23F 102, C03C 1500, C03C 2506

Patent

active

050303180

ABSTRACT:
Methods of making an electrical probe diaphragm wherein the diaphragm is integral with the surrounding support structure, which methods are conducive to the fabrication probing circuitry integral therewith. In accordance with the method, a substrate having first and second surfaces is coated on the first surface with an uncured polymer film in the polymer cured. Also, one or more pattern metalization layers are provided, typical over the polymer layer and extending peripherally outward to contact regions near the periphery of the substrate, preferably accessible from the second side of the substrate so contact with the pattern metalization layer or layers forming the probe circuitry may be made from the second side of the substrate. The central region of the substrate thereafter removed, typically by etching from the second side of the substrate so as to remove the support for the polymer layer and metalization layers in that region, leaving the same as a diaphragm substantially integral with the remaining peripheral region of the substrate. Details of the methods and alternates thereto are disclosed.

REFERENCES:
patent: 4668336 (1987-05-01), Shimkunas
patent: 4784721 (1988-11-01), Holmen et al.

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