Method of making device chips collectively from common...

Details Method of making device chips collectively from common... Method of making device chips collectively from common...

2005-04-19

2005-04-19

Niebling, John F. (Department: 2812)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C438S068000, C438S458000, C438S753000, C359S900000

Reexamination Certificate

active

06881649

ABSTRACT:
A plurality of micromirror chips are collectively made from a common substrate. Each of the micromirror chips is formed with a micromirror unit including a frame, a mirror-forming portion separate from the frame via spaces, and torsion bars connecting the mirror-forming portion to the frame. The common substrate is subjected to etching to provide the spaces and make division grooves for dividing the common substrate into the individual micromirror chips. The etching for the spaces and the etching for the division grooves are performed in parallel with each other.

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