Method of making connector for integrated circuit chips

Details Method of making connector for integrated circuit chips Method of making connector for integrated circuit chips

1993-01-28

1994-12-27

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156651, 156655, 156656, 156901, 29876, B44C 122, C23F 100

Patent

active

053762266

ABSTRACT:
A connector is disclosed for electrically coupling groups of contact points formed on a first and second electronic circuit chip. The connector is constructed by applying a layer of dielectric material to a planar electrically conductive base, lithographically printing a pattern onto the dielectric material, etching the pattern and creating a plurality of wells extending through the dielectric material and a matching plurality of cavities in the surface of the base, and electroplating the pattern and filling the wells with an electrically conductive electroplate material. The electroplate thereby forms a plurality of conductive members, each extending through the dielectric material. The base is then removed from the dielectric material, thereby forming a connector board having the conductive members extending therethrough for electrically coupling the first and second groups of contact points on the circuit chips.

REFERENCES:
patent: 5135606 (1992-08-01), Kato et al.
patent: 5145552 (1992-09-01), Yoshizawa et al.

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