Method of making conductive metal-filled substrates without deve

Details Method of making conductive metal-filled substrates without deve Method of making conductive metal-filled substrates without deve

1990-07-03

1991-09-17

Thurlow, Jeffery

Plastic and nonmetallic article shaping or treating: processes

Forming electrical articles by shaping electroconductive...

252519, 264122, 264126, 264320, 264DIG25, 264325, 419 22, 419 32, B29C 4302

Patent

active

050493329

ABSTRACT:
A conductive-metal-filled substrate is formed by intermingling oxide coated, non-conductive copper or nickel particles into a substrate having a softening point of at least 200.degree. C. followed by compression molding at a temperature of at least 200.degree. C. The filled substrates are electrically conductive and are useful for a variety of uses such as EMI shielding.

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patent: 4778636 (1988-10-01), Krieg et al.
patent: 4931365 (1990-06-01), Inoue et al.
patent: 4963291 (1990-10-01), Bercaw

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