Semiconductor device manufacturing: process – Making device array and selectively interconnecting
Reexamination Certificate
2007-01-16
2007-01-16
Estrada, Michelle (Department: 2823)
Semiconductor device manufacturing: process
Making device array and selectively interconnecting
C438S129000, C257SE29026
Reexamination Certificate
active
11258092
ABSTRACT:
A method of making a circuitized substrate in which the substrate's commoning bar, used during the plating of the circuitry on the substrate, is terminated from the various conductors using a laser. In a preferred embodiment, the laser acts through a dielectric layer (soldermask) which is applied over the circuitry, including the commoning bar and connected parts. The laser may also be used to expose selected ones of the circuit's other parts, including various pads used to accommodate a wirebond (from a chip) and also solder balls for eventual placement of the substrate on a larger circuit board.
REFERENCES:
patent: 4865873 (1989-09-01), Cole, Jr. et al.
patent: 4877644 (1989-10-01), Wu et al.
patent: 5018164 (1991-05-01), Brewer et al.
patent: 5264108 (1993-11-01), Mayer et al.
patent: 5310624 (1994-05-01), Ehrlich
patent: 5843806 (1998-12-01), Tsai
patent: 5968847 (1999-10-01), Ye et al.
patent: 6488862 (2002-12-01), Ye et al.
Antesberger Timothy
Fuller, Jr. James W.
Konrad John J.
Krasniak Stephen
Kresge John
Endicott Interconnect Technologies, Inc.
Estrada Michelle
Fraley Lawrence R.
Hinman, Howard & Kattell LLP
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