Etching a substrate: processes – Etching of semiconductor material to produce an article...
Reexamination Certificate
2005-09-06
2005-09-06
Ahmed, Shamim (Department: 1765)
Etching a substrate: processes
Etching of semiconductor material to produce an article...
C216S067000, C073S504020
Reexamination Certificate
active
06939473
ABSTRACT:
A method for making an angular velocity sensor having two masses which are laterally disposed in an X-Y plane and indirectly connected to a frame provided. The two masses are linked together by a linkage such that they necessarily move in opposite directions along Z. Angular velocity of the sensor about the Y axis can be sensed by driving the two masses into Z-directed antiphase oscillation and measuring the angular oscillation amplitude thereby imparted to the frame. In a preferred embodiment, the angular velocity sensor is fabricated from a bulk MEMS gyroscope wafer, a cap wafer and a reference wafer. In a further preferred embodiment, this assembly wafers provides a hermetic barrier between the masses and an ambient environment.
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Flannery, Jr. Anthony Francis
Nasiri Steven S.
Ahmed Shamim
Invensense Inc.
Sawyer Law Group LLP
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