Semiconductor device manufacturing: process – Making passive device – Stacked capacitor
Reexamination Certificate
2008-06-10
2008-06-10
Le, Thao X. (Department: 2892)
Semiconductor device manufacturing: process
Making passive device
Stacked capacitor
Reexamination Certificate
active
07384856
ABSTRACT:
A method of forming a capacitive substrate in which first and second conductors are formed opposite a dielectric, with one of these electrically coupled to a thru-hole connection. Each functions as an electrode for the resulting capacitor. The substrate is then adapted for being incorporated within a larger structure to form a circuitized substrate such as a printed circuit board or a chip carrier. Additional capacitors are also possible.
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Das Rabindra N.
Lauffer John M.
Markovich Voya R.
Matthews James T.
Arora Ajay K
Endicott Interconnect Technologies, Inc.
Fraley Lawrence R.
Hinman, Howard & Kattell LLP
Le Thao X.
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