Method of making an electronic package

Details Method of making an electronic package Method of making an electronic package

1998-01-12

2000-05-09

Monin, Jr., Donald L.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438111, 438112, H01L 2144

Patent

active

060603410

ABSTRACT:
An electronic package is made by electrically bonding groups of conductive leads to two circuitized members after aligning the leads with electrical conductors on the circuitized members. Retention members may be used to hold the leads in alignment relative to each other prior to bonding and then are removed. Removal may include tearing away the retention member in propinquity to notches in the leads.

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