Method of making an antifuse cell with tungsten silicide electro

Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Ion implantation of dopant into semiconductor region

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257 50, 257530, 438600, 438954, 438533, H01L 2170

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active

056610718

ABSTRACT:
An improved antifuse design has been achieved by using a structure including a region of heavily doped N type silicon coated with a layer of ONO (oxide-nitride-oxide). Top contact to the ONO is made through a layer of tungsten silicide sandwiched between two layers of N type polysilicon. A cost effective method for manufacturing said antifuse structure is described.

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Chang et al, "Conductive Channel in ONO Formed by Controlled Dielectric Breakdown" in 1992 Symposium on VLSI Technology Digest, pp. 20-21.

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