Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1997-07-29
2000-02-29
Bowers, Charles
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438686, 438687, 438688, 438692, H01L 2144
Patent
active
060308958
ABSTRACT:
A soft metal conductor for use in a semiconductor device that has an upper-most layer consisting of grains having grain sizes sufficiently large so as to provide a substantially scratch-free surface upon polishing in a subsequent chemical mechanical polishing step.
REFERENCES:
patent: 3675062 (1972-07-01), Flasche
patent: 3790870 (1974-02-01), Mitchell
patent: 4990410 (1991-02-01), Saitoh et al.
patent: 5262354 (1993-11-01), Cote et al.
patent: 5403779 (1995-04-01), Joshi et al.
patent: 5523259 (1996-06-01), Merchant et al.
patent: 5527739 (1996-06-01), Parrillo et al.
patent: 5672545 (1997-09-01), Trautt et al.
Journal of Vacuum Science and Technology, Part A, vol. 5, No. 4, Jul., 1987-Aug., 1987, New York US, pp. 2088-2091, XP002005739 T. Kobayashi et al.
Joshi Rajiv Vasant
Tejwani Manu Jamnadas
Berry Renee R.
Bowers Charles
International Business Machines - Corporation
Trepp Robert M.
Tung Randy W.
LandOfFree
Method of making a soft metal conductor does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of making a soft metal conductor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making a soft metal conductor will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-682636