Method of making a semiconductor transducer

Details Method of making a semiconductor transducer Method of making a semiconductor transducer

1987-07-14

1989-08-29

Lacey, David L.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156654, 156662, 156645, 437233, 437249, 437901, H01L 2984, G01L 118

Patent

active

048614203

ABSTRACT:
A semiconductor transducer (10) including a substrate having a well (18) formed in one surface thereof and a semiconductor layer (14) having a first surface (26) bonded to the substrate about the periphery of the well to form a diaphragm (30) and a second surface (28) which is substantially parallel to the first surface and has a pedestal (16) projecting therefrom which is disposed above the well. The side walls (32) of the pedestal are substantially orthogonal to the second surface of the semiconductor layer and are formed by sawing edge portions of said semiconductor layer. The substrate includes structures (38) which extend upward from the bottom of the well to limit the deflection of the diaphragm.

REFERENCES:
patent: 3970982 (1976-07-01), Kurtz et al.
patent: 4121334 (1978-10-01), Wallis

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