Method of making a semiconductor chip assembly with metal...

Details Method of making a semiconductor chip assembly with metal... Method of making a semiconductor chip assembly with metal...

2009-02-01

2010-10-12

Pham, Thanh V (Department: 2894)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S106000, C438S107000, C438S109000, C438S112000, C438S118000, C438S119000, C438S124000, C438S126000, C438S127000, C257SE21502

Reexamination Certificate

active

07811863

ABSTRACT:
A method of making a semiconductor chip assembly includes mechanically attaching a semiconductor chip to a routing line, forming a metal pillar on the routing line, forming an encapsulant that covers the chip and the metal pillar, grinding the encapsulant without grinding the metal pillar, then grinding the encapsulant and the metal pillar such that the encapsulant and the metal pillar are laterally aligned, and then attaching a heat sink to the metal pillar.

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