Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2005-03-29
2005-03-29
Dang, Phuc T. (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S107000, C438S611000
Reexamination Certificate
active
06872591
ABSTRACT:
A method of making a semiconductor chip assembly includes providing a semiconductor chip, a conductive trace and a substrate, wherein the chip includes first and second opposing major surfaces and a conductive pad, the pad extends to the first surface of the chip, the substrate includes first and second opposing major surfaces, a conductive terminal and a dielectric base, the conductive terminal extends through the dielectric base to the first and second surfaces of the substrate, a cavity extends from the first surface of the substrate into the substrate, the first surfaces of the chip and the substrate face in a first direction, the second surfaces of the chip and the substrate face in a second direction, and the chip extends into the cavity, and then electrically connecting the conductive terminal to the pad using the conductive trace.
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Lin Charles W. C.
Wang Chia-Chung
Bridge Semiconductor Corporation
Dang Phuc T.
Sigmond David M.
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