Method of making a semiconductor chip assembly with a...

Details Method of making a semiconductor chip assembly with a... Method of making a semiconductor chip assembly with a...

2010-02-28

2011-12-13

Lindsay, Jr., Walter L (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S026000, C438S121000, C257SE21499

Reexamination Certificate

active

08076182

ABSTRACT:
A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a substrate on the adhesive including aligning the post with an aperture in the substrate, then flowing the adhesive into and upward in a gap located in the aperture between the post and the substrate, solidifying the adhesive, then etching the post to form a cavity in the adhesive above the post, then mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base and the semiconductor device extends into the cavity, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader.

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