Method of making a semiconductor chip assembly with a...

Details Method of making a semiconductor chip assembly with a... Method of making a semiconductor chip assembly with a...

2009-11-13

2011-11-29

Bryant, Kiesha (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S026000, C257SE33056, C257SE33075

Reexamination Certificate

active

08067270

ABSTRACT:
A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a substrate on the adhesive including inserting the post into an aperture in the substrate to form a gap in the aperture between the post and the substrate, then flowing the adhesive into and upward in the gap, solidifying the adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader.

REFERENCES:
patent: 3689993 (1972-09-01), Tolar
patent: 3969199 (1976-07-01), Berdan et al.
patent: 4420767 (1983-12-01), Hodge et al.
patent: 4509096 (1985-04-01), Baldwin et al.
patent: 5012386 (1991-04-01), McShane et al.
patent: 5102829 (1992-04-01), Cohn
patent: 5457605 (1995-10-01), Wagner et al.
patent: 5644163 (1997-07-01), Tsuji
patent: 6057601 (2000-05-01), Lau et al.
patent: 6160705 (2000-12-01), Stearns et al.
patent: 6313525 (2001-11-01), Sasano
patent: 6337228 (2002-01-01), Juskey et al.
patent: 6495914 (2002-12-01), Sekine et al.
patent: 6507102 (2003-01-01), Juskey et al.
patent: 6528882 (2003-03-01), Ding et al.
patent: 6541832 (2003-04-01), Coyle
patent: 6583444 (2003-06-01), Fjelstad
patent: 6603209 (2003-08-01), DiStefano et al.
patent: 6625028 (2003-09-01), Dove et al.
patent: 6670219 (2003-12-01), Lee et al.
patent: 6683795 (2004-01-01), Yoo
patent: 6720651 (2004-04-01), Gaku et al.
patent: 6900535 (2005-05-01), Zhou
patent: 6906414 (2005-06-01), Zhao et al.
patent: 6936855 (2005-08-01), Harrah
patent: 6964877 (2005-11-01), Chen et al.
patent: 7038311 (2006-05-01), Woodall et al.
patent: 7196403 (2007-03-01), Karim
patent: 7335522 (2008-02-01), Wang et al.
patent: 7470935 (2008-12-01), Lee et al.
patent: 7582951 (2009-09-01), Zhao et al.
patent: 7642137 (2010-01-01), Lin et al.
patent: 7690817 (2010-04-01), Sanpei et al.
patent: 7741158 (2010-06-01), Leung et al.
patent: 7781266 (2010-08-01), Zhao et al.
patent: 7808087 (2010-10-01), Zhao et al.
patent: 7956372 (2011-06-01), Kamada et al.
patent: 2003/0189830 (2003-10-01), Sugimoto et al.
patent: 2004/0061433 (2004-04-01), Izuno et al.
patent: 2004/0065894 (2004-04-01), Hashimoto et al.
patent: 2005/0135105 (2005-06-01), Teixeira et al.
patent: 2005/0185880 (2005-08-01), Asai
patent: 2006/0012967 (2006-01-01), Asai et al.
patent: 2006/0054915 (2006-03-01), Chang
patent: 2006/0109632 (2006-05-01), Berlin et al.
patent: 2006/0131735 (2006-06-01), Ong et al.
patent: 2007/0063213 (2007-03-01), Hsieh et al.
patent: 2007/0077416 (2007-04-01), Ito et al.
patent: 2007/0252166 (2007-11-01), Chang et al.
patent: 2007/0267642 (2007-11-01), Erchak et al.
patent: 2007/0290322 (2007-12-01), Zhao et al.
patent: 2008/0019133 (2008-01-01), Kim et al.
patent: 2008/0099770 (2008-05-01), Mendendorp et al.
patent: 2008/0102631 (2008-05-01), Andryushchenko et al.
patent: 2008/0128739 (2008-06-01), Sanpei et al.
patent: 2008/0180824 (2008-07-01), Endoh et al.
patent: 2010/0149756 (2010-06-01), Rowcliffe et al.
patent: 2005-166775 (2005-06-01), None
Wilson, et al., “Handbook of Multilevel Metallization for Integrated Circuits: Materials, Technology, and Applications”, 1993, Noyes Publications, First Edition, pp. 819-821.

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