Method of making a semiconductor chip assembly with a...

Details Method of making a semiconductor chip assembly with a... Method of making a semiconductor chip assembly with a...

2009-09-13

2011-11-22

Cao, Phat (Department: 2814)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

C438S025000, C438S026000, C257S098000, C257S099000, C257SE33058

Reexamination Certificate

active

08062912

ABSTRACT:
A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a substrate on the adhesive including inserting the post into an aperture in the substrate to form a gap in the aperture between the post and the substrate, then flowing the adhesive into and upward in the gap, solidifying the adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader. The substrate includes first and second conductive layers and a dielectric layer therebetween and provides horizontal signal routing between a pad and a terminal at the first conductive layer.

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