Method of making a semiconductor chip assembly with a...

Details Method of making a semiconductor chip assembly with a... Method of making a semiconductor chip assembly with a...

2011-08-23

2011-08-23

Graybill, David (Department: 2894)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S118000, C438S122000

Reexamination Certificate

active

08003416

ABSTRACT:
A method of making a semiconductor chip assembly includes providing a post and a base, mounting a first adhesive on the base including inserting the post through an opening in the first adhesive, mounting a conductive layer on the base including aligning the post with an aperture in the conductive layer, providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, then flowing a second adhesive into and downward in a gap between the post and the conductive trace, solidifying the second adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

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