Method of making a self cooling electrically programmable fuse

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

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437902, 437922, H01L 21306, H01L 21326

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active

056228929

ABSTRACT:
A method of fabricating an electrically programmable fuse buried under quartz and layers of polyimide with a specific structure to enhance its "thermal" capabilities. The fuse is designed to "blow" and cool off quickly so as not to cause damage to areas above and surrounding the fuse. A passivation layer is added above the fuse to act as a heat sink and absorb and redistribute the heat generated from one localized area to a broader and cooler area. The materials used for the fuse and the heat sink are selected to be compatible with both oxide and polyimide personalization schemes. Modeling of the fuse enables optimizing the characteristics of the fuse, particularly to transmit to the surface of the passivation layer the thermal wave created during programming of the fuse.

REFERENCES:
patent: 3792319 (1974-02-01), Tsang
patent: 4796075 (1989-01-01), Whitten
patent: 5244836 (1993-09-01), Lim
patent: 5252844 (1993-10-01), Takagi
patent: 5256899 (1993-10-01), Rangappan
Yu.D. Chistyakov, et al., Soviet Microelectronics, 11(1) (1982) 15, "Effect of structural factors on the write current of a fusible link PROM", Jan. 1982.
"Process and Structure for Laser Fuse Blowing", IBM Technical Disclosure Bulletin, vol. 31, No. 12 (May, 1988), p. 93.

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