Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1986-10-06
1987-10-20
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156652, 156657, 1566591, 156662, 357 51, 437228, 437918, H01L 21306, B44C 122, C03C 1500, C23F 100
Patent
active
047012412
ABSTRACT:
A method of forming a resistor comprises forming a conducting layer on a substrate. An area of the layer is removed such as by etching. A resistor portion is formed in the area. The conducting layer including the resistor portion can be p-Si. The substrate can comprise an insulator such as Al.sub.2 O.sub.3 and a barrier layer can be formed on the substrate to achieve improved radiation hardening.
REFERENCES:
patent: 4146902 (1979-03-01), Tanimoto et al.
patent: 4326213 (1982-04-01), Shirai et al.
patent: 4408385 (1983-10-01), Rao et al.
patent: 4451328 (1984-03-01), Dubois
Limberg Allen Le Roy
Powell William A.
RCA Corporation
Steckler Henry I.
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