Method of making a resistor

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156652, 156657, 1566591, 156662, 357 51, 437228, 437918, H01L 21306, B44C 122, C03C 1500, C23F 100

Patent

active

047012412

ABSTRACT:
A method of forming a resistor comprises forming a conducting layer on a substrate. An area of the layer is removed such as by etching. A resistor portion is formed in the area. The conducting layer including the resistor portion can be p-Si. The substrate can comprise an insulator such as Al.sub.2 O.sub.3 and a barrier layer can be formed on the substrate to achieve improved radiation hardening.

REFERENCES:
patent: 4146902 (1979-03-01), Tanimoto et al.
patent: 4326213 (1982-04-01), Shirai et al.
patent: 4408385 (1983-10-01), Rao et al.
patent: 4451328 (1984-03-01), Dubois

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