Method of making a printed circuit board

Details Method of making a printed circuit board Method of making a printed circuit board

1980-09-16

1982-04-20

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29852, 1566611, 156902, 174 685, 204 24, 427 97, 430313, 430318, C23F 102

Patent

active

043257801

ABSTRACT:
A printed circuit board is manufactured by preparing a dielectric substrate with copper-clad surfaces, applying an etch-resist layer in a positive image of the circuit trace, etching away the exposed, non-circuit copper surfacing, and thereafter removing the etch-resist material.

REFERENCES:
patent: 2861029 (1958-11-01), Bain et al.
patent: 3742597 (1973-07-01), Davis
patent: 3772101 (1973-11-01), Chumbres et al.
patent: 4024631 (1977-05-01), Castillero
patent: 4104111 (1978-08-01), Mack

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