Method of making a package utilizing a self-aligning photoexposu

Details Method of making a package utilizing a self-aligning photoexposu Method of making a package utilizing a self-aligning photoexposu

1985-04-29

1987-02-03

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

29840, 174 16HS, 357 81, H05K 330

Patent

active

046400109

ABSTRACT:
The invention discloses an improved PC board package for one or more integrated circuit dies comprising a plurality of PC boards bonded together to form a composite. The composite has at least one cavity, for mounting of an integrated circuit die, formed in at least one PC board of the composite. The cavity walls are plated to seal off portions of the PC board exposed by formation of the cavity to thereby prevent subsequent outgassing. Heat pipes are formed in a PC board adjacent the PC board with the cavity to conduct heat from an integrated circuit chip mounted in the cavity to an opposite surface of the package.

REFERENCES:
patent: 3885304 (1975-05-01), Kaiser et al.
patent: 3916434 (1975-10-01), Garboushian
patent: 4445274 (1984-05-01), Suzuki et al.

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